Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow

Journal

Journal of Electronic Materials

Journal Volume

44

Journal Issue

2

Pages

744-750

Date Issued

2014

Author(s)

Key Chung C.

Zhu Z.X.

DOI

10.1007/s11664-014-3528-0

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84925502794&doi=10.1007%2fs11664-014-3528-0&partnerID=40&md5=2bf3bca997c4e14cf4035f58ced0158d

https://scholars.lib.ntu.edu.tw/handle/123456789/432615

Publisher

Springer New York LLC

Type

journal article