https://scholars.lib.ntu.edu.tw/handle/123456789/432615| Title: | Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow | Authors: | Key Chung C. Zhu Z.X. Kao C.R. C. ROBERT KAO |
Issue Date: | 2014 | Publisher: | Springer New York LLC | Journal Volume: | 44 | Journal Issue: | 2 | Start page/Pages: | 744-750 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84925502794&doi=10.1007%2fs11664-014-3528-0&partnerID=40&md5=2bf3bca997c4e14cf4035f58ced0158d https://scholars.lib.ntu.edu.tw/handle/123456789/432615 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-014-3528-0 |
| Appears in Collections: | 材料科學與工程學系 |
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