https://scholars.lib.ntu.edu.tw/handle/123456789/432629
Title: | Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process | Authors: | Chung C.K. Chen Y.J. Yang T.L. C. ROBERT KAO |
Issue Date: | 2013 | Journal Volume: | 42 | Journal Issue: | 6 | Start page/Pages: | 1254-1259 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84877750407&doi=10.1007%2fs11664-013-2582-3&partnerID=40&md5=0218fd05e8e837b04ecd6aa593fb4c97 https://scholars.lib.ntu.edu.tw/handle/123456789/432629 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-013-2582-3 |
Appears in Collections: | 材料科學與工程學系 |
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