https://scholars.lib.ntu.edu.tw/handle/123456789/432629
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chung C.K. | en_US |
dc.contributor.author | Chen Y.J. | en_US |
dc.contributor.author | Yang T.L. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Yang T.L.;Chen Y.J.;Chung C.K. | - |
dc.date.accessioned | 2019-11-27T02:02:34Z | - |
dc.date.available | 2019-11-27T02:02:34Z | - |
dc.date.issued | 2013 | - |
dc.identifier.issn | 03615235 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84877750407&doi=10.1007%2fs11664-013-2582-3&partnerID=40&md5=0218fd05e8e837b04ecd6aa593fb4c97 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432629 | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s11664-013-2582-3 | - |
dc.identifier.scopus | 2-s2.0-84877750407 | - |
dc.relation.pages | 1254-1259 | - |
dc.relation.journalvolume | 42 | - |
dc.relation.journalissue | 6 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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