https://scholars.lib.ntu.edu.tw/handle/123456789/432637
Title: | Origin and evolution of voids in electroless Ni during soldering reaction | Authors: | Chung C.K. Chen Y.J. Chen W.M. C. ROBERT KAO |
Issue Date: | 2012 | Journal Volume: | 60 | Journal Issue: | 11 | Start page/Pages: | 4586-4593 | Source: | Acta Materialia | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84862805862&doi=10.1016%2fj.actamat.2012.02.018&partnerID=40&md5=de70e87230b082b5f2cc8094e6ddd74a https://scholars.lib.ntu.edu.tw/handle/123456789/432637 |
ISSN: | 13596454 | DOI: | 10.1016/j.actamat.2012.02.018 |
Appears in Collections: | 材料科學與工程學系 |
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