https://scholars.lib.ntu.edu.tw/handle/123456789/432646
Title: | Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging | Authors: | Chuang H.Y. Chen W.M. Shih W.L. Lai Y.S. Kao C.R. C. ROBERT KAO |
Issue Date: | 2011 | Start page/Pages: | 1723-1728 | Source: | Electronic Components and Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-79960427760&doi=10.1109%2fECTC.2011.5898744&partnerID=40&md5=0475831d41429101a611ec8a253026e1 https://scholars.lib.ntu.edu.tw/handle/123456789/432646 |
ISBN: | 9781612844978 | ISSN: | 05695503 | DOI: | 10.1109/ECTC.2011.5898744 |
Appears in Collections: | 材料科學與工程學系 |
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