https://scholars.lib.ntu.edu.tw/handle/123456789/432646
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chuang H.Y. | en_US |
dc.contributor.author | Chen W.M. | en_US |
dc.contributor.author | Shih W.L. | en_US |
dc.contributor.author | Lai Y.S. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Lai Y.S.;Shih W.L.;Chen W.M.;Chuang H.Y. | - |
dc.date.accessioned | 2019-11-27T02:02:39Z | - |
dc.date.available | 2019-11-27T02:02:39Z | - |
dc.date.issued | 2011 | - |
dc.identifier.isbn | 9781612844978 | - |
dc.identifier.issn | 05695503 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-79960427760&doi=10.1109%2fECTC.2011.5898744&partnerID=40&md5=0475831d41429101a611ec8a253026e1 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432646 | - |
dc.relation.ispartof | Electronic Components and Technology Conference | - |
dc.title | Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/ECTC.2011.5898744 | - |
dc.identifier.scopus | 2-s2.0-79960427760 | - |
dc.relation.pages | 1723-1728 | - |
item.openairetype | conference paper | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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