https://scholars.lib.ntu.edu.tw/handle/123456789/432654
Title: | Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control | Authors: | Yang T.L. C. ROBERT KAO |
Issue Date: | 2010 | Source: | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-79951596198&doi=10.1109%2fIMPACT.2010.5699571&partnerID=40&md5=836b94f1400098065585cb2948cd99ca https://scholars.lib.ntu.edu.tw/handle/123456789/432654 |
ISBN: | 9781424497836 | DOI: | 10.1109/IMPACT.2010.5699571 |
Appears in Collections: | 材料科學與工程學系 |
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