https://scholars.lib.ntu.edu.tw/handle/123456789/432669| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chang C.-C. | en-US |
| dc.contributor.author | Kao C.R. | en-US |
| dc.contributor.author | C. ROBERT KAO | zz |
| dc.creator | C. ROBERT KAO;Kao C.R.;Chang C.-C. | - |
| dc.date.accessioned | 2019-11-27T02:02:45Z | - |
| dc.date.available | 2019-11-27T02:02:45Z | - |
| dc.date.issued | 2009 | - |
| dc.identifier.isbn | 9781424443413 | - |
| dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950828729&doi=10.1109%2fIMPACT.2009.5382305&partnerID=40&md5=ac377836b1247053b16eb0929d8d24e2 | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432669 | - |
| dc.relation.ispartof | IMPACT Conference 2009 International 3D IC Conference | - |
| dc.title | Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering | en_US |
| dc.type | conference paper | - |
| dc.identifier.doi | 10.1109/IMPACT.2009.5382305 | - |
| dc.identifier.scopus | 2-s2.0-77950828729 | - |
| dc.relation.pages | 44-47 | - |
| item.openairetype | conference paper | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
| item.fulltext | no fulltext | - |
| item.cerifentitytype | Publications | - |
| item.grantfulltext | none | - |
| crisitem.author.dept | Materials Science and Engineering | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 材料科學與工程學系 | |
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