https://scholars.lib.ntu.edu.tw/handle/123456789/432669
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chang C.-C. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Chang C.-C. | - |
dc.date.accessioned | 2019-11-27T02:02:45Z | - |
dc.date.available | 2019-11-27T02:02:45Z | - |
dc.date.issued | 2009 | - |
dc.identifier.isbn | 9781424443413 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950828729&doi=10.1109%2fIMPACT.2009.5382305&partnerID=40&md5=ac377836b1247053b16eb0929d8d24e2 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432669 | - |
dc.relation.ispartof | IMPACT Conference 2009 International 3D IC Conference | - |
dc.title | Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/IMPACT.2009.5382305 | - |
dc.identifier.scopus | 2-s2.0-77950828729 | - |
dc.relation.pages | 44-47 | - |
item.fulltext | no fulltext | - |
item.grantfulltext | none | - |
item.openairetype | conference paper | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。