Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering

Journal

IMPACT Conference 2009 International 3D IC Conference

Pages

44-47

ISBN

9781424443413

Date Issued

2009

Author(s)

Chang C.-C.

DOI

10.1109/IMPACT.2009.5382305

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950828729&doi=10.1109%2fIMPACT.2009.5382305&partnerID=40&md5=ac377836b1247053b16eb0929d8d24e2

https://scholars.lib.ntu.edu.tw/handle/123456789/432669

Type

conference paper