Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints

Journal

IMPACT Conference 2009 International 3D IC Conference

Pages

444-447

ISBN

9781424443413

Date Issued

2009

Author(s)

Tsai M.-Y.

Lin Y.-L.

DOI

10.1109/IMPACT.2009.5382212

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950817985&doi=10.1109%2fIMPACT.2009.5382212&partnerID=40&md5=a4bcc74f1250cf63580bb92d08b26b89

https://scholars.lib.ntu.edu.tw/handle/123456789/432672

Type

conference paper