https://scholars.lib.ntu.edu.tw/handle/123456789/432672| Title: | Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints | Authors: | Tsai M.-Y. Lin Y.-L. Kao C.R. C. ROBERT KAO |
Issue Date: | 2009 | Start page/Pages: | 444-447 | Source: | IMPACT Conference 2009 International 3D IC Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950817985&doi=10.1109%2fIMPACT.2009.5382212&partnerID=40&md5=a4bcc74f1250cf63580bb92d08b26b89 https://scholars.lib.ntu.edu.tw/handle/123456789/432672 |
ISBN: | 9781424443413 | DOI: | 10.1109/IMPACT.2009.5382212 |
| Appears in Collections: | 材料科學與工程學系 |
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