https://scholars.lib.ntu.edu.tw/handle/123456789/432674
Title: | Development of lead-free solders with superior drop test reliability performance | Authors: | Wang Y.W. C. ROBERT KAO |
Issue Date: | 2009 | Start page/Pages: | 534-539 | Source: | 2009 International Conference on Electronic Packaging Technology and High Density Packaging | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-70450002741&doi=10.1109%2fICEPT.2009.5270694&partnerID=40&md5=e920bc20fa8ed699979769f4018e0d65 https://scholars.lib.ntu.edu.tw/handle/123456789/432674 |
ISBN: | 9781424446599 | DOI: | 10.1109/ICEPT.2009.5270694 |
Appears in Collections: | 材料科學與工程學系 |
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