https://scholars.lib.ntu.edu.tw/handle/123456789/432674| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Wang Y.W. | en-US |
| dc.contributor.author | Kao C.R. | en-US |
| dc.contributor.author | C. ROBERT KAO | zz |
| dc.creator | C. ROBERT KAO;Kao C.R.;Wang Y.W. | - |
| dc.date.accessioned | 2019-11-27T02:02:49Z | - |
| dc.date.available | 2019-11-27T02:02:49Z | - |
| dc.date.issued | 2009 | - |
| dc.identifier.isbn | 9781424446599 | - |
| dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-70450002741&doi=10.1109%2fICEPT.2009.5270694&partnerID=40&md5=e920bc20fa8ed699979769f4018e0d65 | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432674 | - |
| dc.relation.ispartof | 2009 International Conference on Electronic Packaging Technology and High Density Packaging | - |
| dc.title | Development of lead-free solders with superior drop test reliability performance | en_US |
| dc.type | conference paper | - |
| dc.identifier.doi | 10.1109/ICEPT.2009.5270694 | - |
| dc.identifier.scopus | 2-s2.0-70450002741 | - |
| dc.relation.pages | 534-539 | - |
| item.openairetype | conference paper | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
| item.fulltext | no fulltext | - |
| item.cerifentitytype | Publications | - |
| item.grantfulltext | none | - |
| crisitem.author.dept | Materials Science and Engineering | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 材料科學與工程學系 | |
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