https://scholars.lib.ntu.edu.tw/handle/123456789/432676
DC Field | Value | Language |
---|---|---|
dc.contributor.author | CHIEN-CHENG CHANG | en_US |
dc.contributor.author | Lin Y.W. | en_US |
dc.contributor.author | Lai Y.S. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Lai Y.S.;Lin Y.W.;Chang C.C. | - |
dc.date.accessioned | 2019-11-27T02:02:49Z | - |
dc.date.available | 2019-11-27T02:02:49Z | - |
dc.date.issued | 2009 | - |
dc.identifier.issn | 03615235 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-70349861935&doi=10.1007%2fs11664-009-0866-4&partnerID=40&md5=a620ca38bda31208177d8c22c2035c48 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432676 | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s11664-009-0866-4 | - |
dc.identifier.scopus | 2-s2.0-70349861935 | - |
dc.relation.pages | 2234-2241 | - |
dc.relation.journalvolume | 38 | - |
dc.relation.journalissue | 11 | - |
item.openairetype | journal article | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Applied Mechanics | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
Appears in Collections: | 材料科學與工程學系 |
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