Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

Journal

Journal of Alloys and Compounds

Journal Volume

478

Journal Issue

1-2

Pages

121-127

Date Issued

2009

Author(s)

Wang Y.W.

Lin Y.W.

Tu C.T.

DOI

10.1016/j.jallcom.2008.11.052

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-67349083563&doi=10.1016%2fj.jallcom.2008.11.052&partnerID=40&md5=e3490373465c121ddfe91fe66a8421b4

https://scholars.lib.ntu.edu.tw/handle/123456789/432679

Type

journal article