https://scholars.lib.ntu.edu.tw/handle/123456789/432684
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Hung L.Y. | en_US |
dc.contributor.author | Chang P.H. | en_US |
dc.contributor.author | Chang C.C. | en_US |
dc.contributor.author | Wang Y.P. | en_US |
dc.contributor.author | Hsiao C.S. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Hsiao C.S.;Wang Y.P.;Chang C.C.;Chang P.H.;Hung L.Y. | - |
dc.date.accessioned | 2019-11-27T02:02:52Z | - |
dc.date.available | 2019-11-27T02:02:52Z | - |
dc.date.issued | 2008 | - |
dc.identifier.isbn | 9781424436248 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049107879&doi=10.1109%2fIMPACT.2008.4783859&partnerID=40&md5=f30e464f692e419a1301ea9771ef0454 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432684 | - |
dc.relation.ispartof | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | - |
dc.title | Microstructure study of high lead bump FCBGA bending test | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/IMPACT.2008.4783859 | - |
dc.identifier.scopus | 2-s2.0-64049107879 | - |
dc.relation.pages | 255-258 | - |
item.openairetype | conference paper | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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