https://scholars.lib.ntu.edu.tw/handle/123456789/432685
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lail Y.-S. | en_US |
dc.contributor.author | Kao C.R. | en_US |
dc.contributor.author | Chang H.-C. | en_US |
dc.contributor.author | Lee S.-H. | en_US |
dc.contributor.author | Kao C.-L. | en_US |
dc.contributor.author | Lan W.-H. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Lan W.-H.;Kao C.-L.;Lee S.-H.;Chang H.-C.;Kao C.R.;Lail Y.-S. | - |
dc.date.accessioned | 2019-11-27T02:02:52Z | - |
dc.date.available | 2019-11-27T02:02:52Z | - |
dc.date.issued | 2008 | - |
dc.identifier.isbn | 9781424436248 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049103988&doi=10.1109%2fIMPACT.2008.4783806&partnerID=40&md5=b4411409dded19125d9c95ee98af7f69 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432685 | - |
dc.relation.ispartof | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | - |
dc.title | Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/IMPACT.2008.4783806 | - |
dc.identifier.scopus | 2-s2.0-64049103988 | - |
dc.relation.pages | 53-56 | - |
item.cerifentitytype | Publications | - |
item.grantfulltext | none | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。