https://scholars.lib.ntu.edu.tw/handle/123456789/432690
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chang C.C. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Chang C.C. | - |
dc.date.accessioned | 2019-11-27T02:02:55Z | - |
dc.date.available | 2019-11-27T02:02:55Z | - |
dc.date.issued | 2007 | - |
dc.identifier.isbn | 9781424416370 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-48649107274&doi=10.1109%2fIMPACT.2007.4433566&partnerID=40&md5=5f82e4bb6a8ea65f6fbfb02712fec9ca | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432690 | - |
dc.relation.ispartof | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | - |
dc.title | Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/IMPACT.2007.4433566 | - |
dc.identifier.scopus | 2-s2.0-48649107274 | - |
dc.relation.pages | 54-57 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。