https://scholars.lib.ntu.edu.tw/handle/123456789/432692
Title: | The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface | Authors: | Wang Y.W. C. ROBERT KAO |
Issue Date: | 2007 | Start page/Pages: | 280-283 | Source: | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-48649091025&doi=10.1109%2fIMPACT.2007.4433617&partnerID=40&md5=70c6d0380b18ed717334a0833e493c7a https://scholars.lib.ntu.edu.tw/handle/123456789/432692 |
ISBN: | 9781424416370 | DOI: | 10.1109/IMPACT.2007.4433617 |
Appears in Collections: | 材料科學與工程學系 |
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