https://scholars.lib.ntu.edu.tw/handle/123456789/432706
Title: | Local melting induced by electromigration in flip-chip solder joints | Authors: | Tsai C.M. Lin Y.L. Tsai J.Y. Lai Y.I.-S. C. ROBERT KAO |
Issue Date: | 2006 | Journal Volume: | 35 | Journal Issue: | 5 | Start page/Pages: | 1005-1009 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745065485&doi=10.1007%2fBF02692560&partnerID=40&md5=79ca49cef79cf29b443c2d8f8d1f1af8 https://scholars.lib.ntu.edu.tw/handle/123456789/432706 |
ISSN: | 03615235 | DOI: | 10.1007/BF02692560 |
Appears in Collections: | 材料科學與工程學系 |
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