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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Local melting induced by electromigration in flip-chip solder joints
Details
Local melting induced by electromigration in flip-chip solder joints
Journal
Journal of Electronic Materials
Journal Volume
35
Journal Issue
5
Pages
1005-1009
Date Issued
2006
Author(s)
Tsai C.M.
Lin Y.L.
Tsai J.Y.
Lai Y.I.-S.
C. ROBERT KAO
DOI
10.1007/BF02692560
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745065485&doi=10.1007%2fBF02692560&partnerID=40&md5=79ca49cef79cf29b443c2d8f8d1f1af8
https://scholars.lib.ntu.edu.tw/handle/123456789/432706
Type
conference paper