Local melting induced by electromigration in flip-chip solder joints

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

5

Pages

1005-1009

Date Issued

2006

Author(s)

Tsai C.M.

Lin Y.L.

Tsai J.Y.

Lai Y.I.-S.

DOI

10.1007/BF02692560

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745065485&doi=10.1007%2fBF02692560&partnerID=40&md5=79ca49cef79cf29b443c2d8f8d1f1af8

https://scholars.lib.ntu.edu.tw/handle/123456789/432706

Type

conference paper