https://scholars.lib.ntu.edu.tw/handle/123456789/432706| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Tsai C.M. | en-US |
| dc.contributor.author | Lin Y.L. | en-US |
| dc.contributor.author | Tsai J.Y. | en-US |
| dc.contributor.author | Lai Y.I.-S. | en-US |
| dc.contributor.author | Kao C.R. | en-US |
| dc.contributor.author | C. ROBERT KAO | zz |
| dc.creator | C. ROBERT KAO;Kao C.R.;Lai Y.I.-S.;Tsai J.Y.;Lin Y.L.;Tsai C.M. | - |
| dc.date.accessioned | 2019-11-27T02:03:00Z | - |
| dc.date.available | 2019-11-27T02:03:00Z | - |
| dc.date.issued | 2006 | - |
| dc.identifier.issn | 03615235 | - |
| dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745065485&doi=10.1007%2fBF02692560&partnerID=40&md5=79ca49cef79cf29b443c2d8f8d1f1af8 | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432706 | - |
| dc.relation.ispartof | Journal of Electronic Materials | - |
| dc.title | Local melting induced by electromigration in flip-chip solder joints | en_US |
| dc.type | conference paper | - |
| dc.identifier.doi | 10.1007/BF02692560 | - |
| dc.identifier.scopus | 2-s2.0-33745065485 | - |
| dc.relation.pages | 1005-1009 | - |
| dc.relation.journalvolume | 35 | - |
| dc.relation.journalissue | 5 | - |
| item.fulltext | no fulltext | - |
| item.cerifentitytype | Publications | - |
| item.openairetype | conference paper | - |
| item.grantfulltext | none | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
| crisitem.author.dept | Materials Science and Engineering | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 材料科學與工程學系 | |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.