In-situ observation of material migration in flip-chip solder joints under current stressing

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

10

Pages

1781-1786

Date Issued

2006

Author(s)

Tsai C.M.

Lai Y.-S.

Lin Y.L.

Chang C.W.

DOI

10.1007/s11664-006-0157-2

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33750181244&doi=10.1007%2fs11664-006-0157-2&partnerID=40&md5=357815571e6a54e43a89ac9d7051d3e3

https://scholars.lib.ntu.edu.tw/handle/123456789/432709

Publisher

Springer New York

Type

journal article