https://scholars.lib.ntu.edu.tw/handle/123456789/432710| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Tsai J.Y. | en-US |
| dc.contributor.author | Chang C.W. | en-US |
| dc.contributor.author | Ho C.E. | en-US |
| dc.contributor.author | Lin Y.L. | en-US |
| dc.contributor.author | Kao C.R. | en-US |
| dc.contributor.author | C. ROBERT KAO | zz |
| dc.creator | C. ROBERT KAO;Kao C.R.;Lin Y.L.;Ho C.E.;Chang C.W.;Tsai J.Y. | - |
| dc.date.accessioned | 2019-11-27T02:03:01Z | - |
| dc.date.available | 2019-11-27T02:03:01Z | - |
| dc.date.issued | 2006 | - |
| dc.identifier.issn | 03615235 | - |
| dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-32644450179&doi=10.1007%2fs11664-006-0185-y&partnerID=40&md5=4b7ebda168056be021e064571056ec4c | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432710 | - |
| dc.publisher | Minerals, Metals and Materials Society | - |
| dc.relation.ispartof | Journal of Electronic Materials | - |
| dc.title | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | en_US |
| dc.type | conference paper | - |
| dc.identifier.doi | 10.1007/s11664-006-0185-y | - |
| dc.identifier.scopus | 2-s2.0-32644450179 | - |
| dc.relation.pages | 65-71 | - |
| dc.relation.journalvolume | 35 | - |
| dc.relation.journalissue | 1 | - |
| item.fulltext | no fulltext | - |
| item.cerifentitytype | Publications | - |
| item.openairetype | conference paper | - |
| item.grantfulltext | none | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
| crisitem.author.dept | Materials Science and Engineering | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 材料科學與工程學系 | |
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