Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

1

Pages

65-71

Date Issued

2006

Author(s)

Tsai J.Y.

Chang C.W.

Ho C.E.

Lin Y.L.

DOI

10.1007/s11664-006-0185-y

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-32644450179&doi=10.1007%2fs11664-006-0185-y&partnerID=40&md5=4b7ebda168056be021e064571056ec4c

https://scholars.lib.ntu.edu.tw/handle/123456789/432710

Publisher

Minerals, Metals and Materials Society

Type

journal article