https://scholars.lib.ntu.edu.tw/handle/123456789/432714
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lin Y.H. | en_US |
dc.contributor.author | Tsai C.M. | en_US |
dc.contributor.author | Hu Y.C. | en_US |
dc.contributor.author | Lin Y.L. | en_US |
dc.contributor.author | Tsai J.Y. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Tsai J.Y.;Lin Y.L.;Hu Y.C.;Tsai C.M.;Lin Y.H. | - |
dc.date.accessioned | 2019-11-27T02:03:02Z | - |
dc.date.available | 2019-11-27T02:03:02Z | - |
dc.date.issued | 2005 | - |
dc.identifier.issn | 02555476 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-17044413733&partnerID=40&md5=b0659801f3f122318f9736e6e6e10a7f | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432714 | - |
dc.relation.ispartof | Materials Science Forum | - |
dc.title | Electromigration induced metal dissolution in flip-chip solder joints | en_US |
dc.type | conference paper | en |
dc.identifier.scopus | 2-s2.0-17044413733 | - |
dc.relation.pages | 2655-2658 | - |
dc.relation.journalvolume | 475-479 | - |
dc.relation.journalissue | IV | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
Appears in Collections: | 材料科學與工程學系 |
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