https://scholars.lib.ntu.edu.tw/handle/123456789/432720
Title: | Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints | Authors: | Lin Y.L. Luo W.C. Lin Y.H. Ho C.E. C. ROBERT KAO |
Issue Date: | 2004 | Publisher: | Minerals, Metals and Materials Society | Journal Volume: | 33 | Journal Issue: | 10 | Start page/Pages: | 1092-1097 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-7044223296&doi=10.1007%2fs11664-004-0109-7&partnerID=40&md5=4600ca4f4c252c1a716a42ef72511822 https://scholars.lib.ntu.edu.tw/handle/123456789/432720 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-004-0109-7 |
Appears in Collections: | 材料科學與工程學系 |
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