https://scholars.lib.ntu.edu.tw/handle/123456789/432721
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Tsai C.M. | en_US |
dc.contributor.author | Luo W.C. | en_US |
dc.contributor.author | Chang C.W. | en_US |
dc.contributor.author | Shieh Y.C. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Shieh Y.C.;Chang C.W.;Luo W.C.;Tsai C.M. | - |
dc.date.accessioned | 2019-11-27T02:03:04Z | - |
dc.date.available | 2019-11-27T02:03:04Z | - |
dc.date.issued | 2004 | - |
dc.identifier.issn | 03615235 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-11344255513&doi=10.1007%2fs11664-004-0082-1&partnerID=40&md5=aaa6731835481f3efaba680171c381e0 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432721 | - |
dc.publisher | Minerals, Metals and Materials Society | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s11664-004-0082-1 | - |
dc.identifier.scopus | 2-s2.0-11344255513 | - |
dc.relation.pages | 1424-1428 | - |
dc.relation.journalvolume | 33 | - |
dc.relation.journalissue | 12 | - |
item.fulltext | no fulltext | - |
item.openairetype | journal article | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。