https://scholars.lib.ntu.edu.tw/handle/123456789/432736
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin Y.H. | en_US |
dc.contributor.author | Hu Y.C. | en_US |
dc.contributor.author | Tsai J. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Tsai J.;Hu Y.C.;Lin Y.H. | - |
dc.date.accessioned | 2019-11-27T02:03:09Z | - |
dc.date.available | 2019-11-27T02:03:09Z | - |
dc.date.issued | 2002 | - |
dc.identifier.isbn | 078037682X | - |
dc.identifier.isbn | 9780780376823 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966603300&doi=10.1109%2fEMAP.2002.1188846&partnerID=40&md5=c0a1369b4261d2d53eac4eb07c35ef4e | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432736 | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.relation.ispartof | 4th International Symposium on Electronic Materials and Packaging 2002 | - |
dc.title | New failure mode induced by electric current in flip chip solder joint | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/EMAP.2002.1188846 | - |
dc.identifier.scopus | 2-s2.0-84966603300 | - |
dc.relation.pages | 253-258 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。