https://scholars.lib.ntu.edu.tw/handle/123456789/432741| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ho C.E. | en-US |
| dc.contributor.author | Chen W.T. | en-US |
| dc.contributor.author | Kao C.R. | en-US |
| dc.contributor.author | C. ROBERT KAO | zz |
| dc.creator | C. ROBERT KAO;Kao C.R.;Chen W.T.;Ho C.E. | - |
| dc.date.accessioned | 2019-11-27T02:03:10Z | - |
| dc.date.available | 2019-11-27T02:03:10Z | - |
| dc.date.issued | 2001 | - |
| dc.identifier.issn | 03615235 | - |
| dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035305461&doi=10.1007%2fs11664-001-0047-6&partnerID=40&md5=960a3f31005adf4335288b12742228a9 | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432741 | - |
| dc.publisher | Minerals, Metals and Materials Society | - |
| dc.relation.ispartof | Journal of Electronic Materials | - |
| dc.title | Interactions between solder and metallization during long-term aging of advanced microelectronic packages | en_US |
| dc.type | journal article | - |
| dc.identifier.doi | 10.1007/s11664-001-0047-6 | - |
| dc.identifier.scopus | 2-s2.0-0035305461 | - |
| dc.relation.pages | 379-385 | - |
| dc.relation.journalvolume | 30 | - |
| dc.relation.journalissue | 4 | - |
| item.openairetype | journal article | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
| item.fulltext | no fulltext | - |
| item.cerifentitytype | Publications | - |
| item.grantfulltext | none | - |
| crisitem.author.dept | Materials Science and Engineering | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 材料科學與工程學系 | |
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