Interactions between solder and metallization during long-term aging of advanced microelectronic packages

Journal

Journal of Electronic Materials

Journal Volume

30

Journal Issue

4

Pages

379-385

Date Issued

2001

Author(s)

Ho C.E.

Chen W.T.

DOI

10.1007/s11664-001-0047-6

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035305461&doi=10.1007%2fs11664-001-0047-6&partnerID=40&md5=960a3f31005adf4335288b12742228a9

https://scholars.lib.ntu.edu.tw/handle/123456789/432741

Publisher

Minerals, Metals and Materials Society

Type

journal article