https://scholars.lib.ntu.edu.tw/handle/123456789/432745
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Ho C.E. | en_US |
dc.contributor.author | Zheng R. | en_US |
dc.contributor.author | Luo G.L. | en_US |
dc.contributor.author | Lin A.H. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Lin A.H.;Luo G.L.;Zheng R.;Ho C.E. | - |
dc.date.accessioned | 2019-11-27T02:03:11Z | - |
dc.date.available | 2019-11-27T02:03:11Z | - |
dc.date.issued | 2000 | - |
dc.identifier.issn | 03615235 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034295436&doi=10.1007%2fs11664-000-0010-y&partnerID=40&md5=8c6a57a06158fc9d48d529375de7fa8d | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432745 | - |
dc.publisher | Minerals, Metals & Materials Soc (TMS), Warrendale | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s11664-000-0010-y | - |
dc.identifier.scopus | 2-s2.0-0034295436 | - |
dc.relation.pages | 1175-1181 | - |
dc.relation.journalvolume | 29 | - |
dc.relation.journalissue | 10 | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.cerifentitytype | Publications | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。