https://scholars.lib.ntu.edu.tw/handle/123456789/443538
Title: | High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging | Authors: | Lin, C. J. Lin, M. T. Wu, S. P. Tseng, F. G. MINN-TSONG LIN |
Issue Date: | 2004 | Journal Volume: | 10 | Start page/Pages: | 517-521 | Source: | Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/443538 | ISSN: | 0946-7076 | DOI: | 10.1007/s00542-004-0384-5 |
Appears in Collections: | 物理學系 |
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