https://scholars.lib.ntu.edu.tw/handle/123456789/486036
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chang, C. C. | en_US |
dc.contributor.author | Yang, S. C. | en_US |
dc.contributor.author | Chen, Y. J. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.contributor.author | CHIEN-CHENG CHANG | en_US |
dc.creator | CHIEN-CHENG CHANG;Kao, C. R.;Chen, Y. J.;Yang, S. C.;Chang, C. C. | - |
dc.date.accessioned | 2020-04-28T07:11:47Z | - |
dc.date.available | 2020-04-28T07:11:47Z | - |
dc.date.issued | 2011 | - |
dc.identifier.issn | 1862-5282 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/486036 | - |
dc.relation.ispartof | International Journal of Materials Research | - |
dc.title | Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.3139/146.110502 | - |
dc.identifier.isi | WOS:000290973300013 | - |
dc.relation.pages | 579-583 | - |
dc.relation.journalvolume | 102 | - |
dc.relation.journalissue | 5 | - |
item.fulltext | no fulltext | - |
item.cerifentitytype | Publications | - |
item.openairetype | journal article | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.dept | Applied Mechanics | - |
crisitem.author.parentorg | College of Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 應用力學研究所 |
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