https://scholars.lib.ntu.edu.tw/handle/123456789/491962
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin, Y.-C. | en_US |
dc.contributor.author | Yang, C.-L. | en_US |
dc.contributor.author | Huang, J.-Y. | en_US |
dc.contributor.author | Jain, C.-C. | en_US |
dc.contributor.author | Hwang, J.-D. | en_US |
dc.contributor.author | Chu, H.-S. | en_US |
dc.contributor.author | Chen, S.-C. | en_US |
dc.contributor.author | Chuang, T.-H. | en_US |
dc.contributor.author | TUNG-HAN CHUANG | en_US |
dc.creator | TUNG-HAN CHUANG;Chuang, T.-H.;Chen, S.-C.;Chu, H.-S.;Hwang, J.-D.;Jain, C.-C.;Huang, J.-Y.;Yang, C.-L.;Lin, Y.-C. | - |
dc.date.accessioned | 2020-05-12T02:53:04Z | - |
dc.date.available | 2020-05-12T02:53:04Z | - |
dc.date.issued | 2016 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/491962 | - |
dc.relation.ispartof | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | - |
dc.title | Low-Temperature Bonding of Bi<inf>0.5</inf>Sb<inf>1.5</inf>Te<inf>3</inf> Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s11661-016-3641-1 | - |
dc.identifier.scopus | 2-s2.0-84978128129 | - |
dc.identifier.url | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84978128129&doi=10.1007%2fs11661-016-3641-1&partnerID=40&md5=72e25ff96b5f6f38c7e17e0fa3ad6aa0 | - |
dc.relation.pages | 4767-4776 | - |
dc.relation.journalvolume | 47 | - |
dc.relation.journalissue | 9 | - |
item.openairetype | journal article | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.fulltext | no fulltext | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
顯示於: | 材料科學與工程學系 |
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