https://scholars.lib.ntu.edu.tw/handle/123456789/491994
Title: | Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishes | Authors: | Chuang, T.H. Jain, C.C. Wang, S.S. TUNG-HAN CHUANG |
Issue Date: | 2009 | Journal Volume: | 18 | Journal Issue: | 8 | Start page/Pages: | 1133-1139 | Source: | Journal of Materials Engineering and Performance | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/491994 | DOI: | 10.1007/s11665-008-9344-z |
Appears in Collections: | 材料科學與工程學系 |
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