https://scholars.lib.ntu.edu.tw/handle/123456789/492033
Title: | Intermetallic compounds formed at the interface between liquid indium and copper substrates | Authors: | Yu, C.L. Wang, S.S. Chuang, T.H. TUNG-HAN CHUANG |
Issue Date: | 2002 | Journal Volume: | 31 | Journal Issue: | 5 | Start page/Pages: | 488-493 | Source: | Journal of Electronic Materials | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/492033 | DOI: | 10.1007/s11664-002-0104-9 |
Appears in Collections: | 材料科學與工程學系 |
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