https://scholars.lib.ntu.edu.tw/handle/123456789/492034
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chiu, M.Y. | en_US |
dc.contributor.author | Wang, S.S. | en_US |
dc.contributor.author | Chuang, T.H. | en_US |
dc.contributor.author | TUNG-HAN CHUANG | en_US |
dc.creator | TUNG-HAN CHUANG;Chuang, T.H.;Wang, S.S.;Chiu, M.Y. | - |
dc.date.accessioned | 2020-05-12T02:53:18Z | - |
dc.date.available | 2020-05-12T02:53:18Z | - |
dc.date.issued | 2002 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/492034 | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s11664-002-0105-8 | - |
dc.identifier.scopus | 2-s2.0-0036575443 | - |
dc.identifier.url | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036575443&doi=10.1007%2fs11664-002-0105-8&partnerID=40&md5=89c46c3a0754c14b2facbef33e429b62 | - |
dc.relation.pages | 494-499 | - |
dc.relation.journalvolume | 31 | - |
dc.relation.journalissue | 5 | - |
item.openairetype | journal article | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.fulltext | no fulltext | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
Appears in Collections: | 材料科學與工程學系 |
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