Equivalent circuit of a through via in multi-layer environment

Journal

Electrical Performance of Electronic Packaging, EPEP 1992

Pages

59-61

Date Issued

1992

Author(s)

Chang, K.K.

Kuo, C.-N.

Wu, T.-L.

Chen, W.-L.

Wu, R.-B.

DOI

10.1109/EPEP.1992.572265

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/498074

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-77952745589&doi=10.1109%2fEPEP.1992.572265&partnerID=40&md5=8c46a4a3d3f2031f9673d839ecf2dfdb

Type

conference paper