https://scholars.lib.ntu.edu.tw/handle/123456789/498074| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chang, K.K. | en_US |
| dc.contributor.author | Kuo, C.-N. | en_US |
| dc.contributor.author | Wu, T.-L. | en_US |
| dc.contributor.author | Chen, W.-L. | en_US |
| dc.contributor.author | Wu, R.-B. | en_US |
| dc.contributor.author | TZONG-LIN WU | zz |
| dc.creator | TZONG-LIN WU;Wu, R.-B.;Chen, W.-L.;Wu, T.-L.;Kuo, C.-N.;Chang, K.K. | - |
| dc.date.accessioned | 2020-06-11T06:15:28Z | - |
| dc.date.available | 2020-06-11T06:15:28Z | - |
| dc.date.issued | 1992 | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/498074 | - |
| dc.relation.ispartof | Electrical Performance of Electronic Packaging, EPEP 1992 | - |
| dc.title | Equivalent circuit of a through via in multi-layer environment | en_US |
| dc.type | conference paper | - |
| dc.identifier.doi | 10.1109/EPEP.1992.572265 | - |
| dc.identifier.scopus | 2-s2.0-77952745589 | - |
| dc.identifier.url | https://www.scopus.com/inward/record.uri?eid=2-s2.0-77952745589&doi=10.1109%2fEPEP.1992.572265&partnerID=40&md5=8c46a4a3d3f2031f9673d839ecf2dfdb | - |
| dc.relation.pages | 59-61 | - |
| item.cerifentitytype | Publications | - |
| item.fulltext | no fulltext | - |
| item.grantfulltext | none | - |
| item.openairetype | conference paper | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
| crisitem.author.dept | Electrical Engineering | - |
| crisitem.author.dept | Communication Engineering | - |
| crisitem.author.orcid | 0000-0002-3560-8898 | - |
| crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
| crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
| Appears in Collections: | 電機工程學系 | |
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