https://scholars.lib.ntu.edu.tw/handle/123456789/546626
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Sheikhi, R. | en_US |
dc.contributor.author | Huo, Y. | en_US |
dc.contributor.author | Tsai, C.-H. | en_US |
dc.contributor.author | Kao, C.R. | en_US |
dc.contributor.author | Shi, F.G. | en_US |
dc.contributor.author | Lee, C.C. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | Sheikhi, R.;Huo, Y.;Tsai, C.-H.;Kao, C.R.;Shi, F.G.;Lee, C.C. | - |
dc.date.accessioned | 2021-02-04T02:27:25Z | - |
dc.date.available | 2021-02-04T02:27:25Z | - |
dc.date.issued | 2020 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.url?eid=2-s2.0-85084088997&partnerID=40&md5=20934cceb2fa36de7fc5a6fc4c88d968 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/546626 | - |
dc.relation.ispartof | Journal of Materials Science: Materials in Electronics | - |
dc.title | Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structure | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s10854-020-03346-2 | - |
dc.identifier.scopus | 2-s2.0-85084088997 | - |
dc.identifier.isi | WOS:000528116100001 | - |
dc.relation.pages | 8059-8071 | - |
dc.relation.journalvolume | 31 | - |
dc.relation.journalissue | 10 | - |
item.fulltext | no fulltext | - |
item.openairetype | journal article | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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