https://scholars.lib.ntu.edu.tw/handle/123456789/546731
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chen, C.-H. | en_US |
dc.contributor.author | Lin, Y.-C. | en_US |
dc.contributor.author | Groth, A. | en_US |
dc.contributor.author | Lai, Y.-C. | en_US |
dc.contributor.author | Lin, C.-Y. | en_US |
dc.contributor.author | Chang, H.-M. | en_US |
dc.contributor.author | Chuang, T.-H. | en_US |
dc.contributor.author | TUNG-HAN CHUANG | en_US |
dc.creator | Chen, C.-H.;Lin, Y.-C.;Groth, A.;Lai, Y.-C.;Lin, C.-Y.;Chang, H.-M.;Chuang, T.-H. | - |
dc.date.accessioned | 2021-02-04T02:27:54Z | - |
dc.date.available | 2021-02-04T02:27:54Z | - |
dc.date.issued | 2020 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.url?eid=2-s2.0-85086066293&partnerID=40&md5=e3ae3643a92ca36385a571715c0fb32b | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/546731 | - |
dc.relation.ispartof | IEEE Transactions on Components, Packaging and Manufacturing Technology | - |
dc.title | Ultrasonic Bonding of Ag and Ag-Alloy Ribbon - An Innovative Alternative for High Power IC Packages | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1109/TCPMT.2020.2988129 | - |
dc.identifier.scopus | 2-s2.0-85086066293 | - |
dc.identifier.isi | WOS:000541132400016 | - |
dc.relation.pages | 1061-1068 | - |
dc.relation.journalvolume | 10 | - |
dc.relation.journalissue | 6 | - |
item.fulltext | no fulltext | - |
item.cerifentitytype | Publications | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.openairetype | journal article | - |
顯示於: | 材料科學與工程學系 |
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