https://scholars.lib.ntu.edu.tw/handle/123456789/547492
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chien, H.-C. | en_US |
dc.contributor.author | Huang, M.-J. | en_US |
dc.contributor.author | Chen, Z.-Z. | en_US |
dc.contributor.author | MEI-JIAU HUANG | en_US |
dc.creator | Chien, H.-C.; Huang, M.-J.; Chen, Z.-Z. | - |
dc.date.accessioned | 2021-02-04T02:48:58Z | - |
dc.date.available | 2021-02-04T02:48:58Z | - |
dc.date.issued | 2020 | - |
dc.identifier.issn | Chien, H.-C.;Huang, M.-J.;Chen, Z.-Z. | - |
dc.identifier.uri | https://www.scopus.com/inward/record.url?eid=2-s2.0-85093661569&partnerID=40&md5=d9787d9fbd8318914fa1f7d964bbc067 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/547492 | - |
dc.relation.ispartof | 2020 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2020 | - |
dc.title | Thermal performance analysis of a package using non-simulation technique | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/VLSI-TSA48913.2020.9203733 | - |
dc.identifier.scopus | 2-s2.0-85093661569 | - |
dc.relation.pages | 76-77 | - |
item.cerifentitytype | Publications | - |
item.openairetype | conference paper | - |
item.fulltext | no fulltext | - |
item.grantfulltext | none | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
crisitem.author.dept | Mechanical Engineering | - |
crisitem.author.orcid | exist | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 機械工程學系 |
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