https://scholars.lib.ntu.edu.tw/handle/123456789/598273
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Gao, J.-Y. | en_US |
dc.contributor.author | Chen, C.-K. | en_US |
dc.contributor.author | Lin, Y.-C. | en_US |
dc.contributor.author | Kuo, C.-C. | en_US |
dc.contributor.author | WEN-CHANG CHEN | en_US |
dc.date.accessioned | 2022-03-22T08:27:04Z | - |
dc.date.available | 2022-03-22T08:27:04Z | - |
dc.date.issued | 2021 | - |
dc.identifier.issn | 14387492 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85113297106&doi=10.1002%2fmame.202100512&partnerID=40&md5=c000e0bd6edbefb240cc8f9df18c4fa2 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/598273 | - |
dc.description.abstract | Flexible memory devices are one of the most crucial elements in the wearable electronics. In this work, polyimides (PIs)-based flexible resistive memory devices with an excellent thermal and mechanical durability are demonstrated. Four kinds of functional PIs are derived from the heterocyclic diamines including 2,6-diaminodibenzo-p-dioxin (OODA) and 2,6-diaminothianthrene, and dianhydrides including 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride. PI with diamine of OODA and dianhydride of 6FDA (PI(OODA_6FDA)) possesses outstanding thermal and mechanical properties with a high glass transition temperature of 352?°C, a low coefficient of thermal expansion of 28.1?ppm K?1, and a high elongation at break of 10%. In addition, PI(OODA_6FDA)-based memory shows write-once-read-many behavior with a high on/off current ratio of 106 and a stable data retention, attributed to the donor–acceptor charge transfer between the polymer chains. The retained current levels at a low resistive state can be observed even with thermal treatment at 200?°C for 24 h or 1000 times cyclic bending at a bending radius of 5?mm. These results demonstrate the potential of heterocyclic PIs for flexible resistive memory. ? 2021 Wiley-VCH GmbH | - |
dc.relation.ispartof | Macromolecular Materials and Engineering | - |
dc.subject | donor–acceptor | - |
dc.subject | flexible electronics | - |
dc.subject | polyimide | - |
dc.subject | resistor-type memory | - |
dc.subject | write-once-read-many (WORM) type memory | - |
dc.subject | Amines | - |
dc.subject | Aromatic compounds | - |
dc.subject | Charge transfer | - |
dc.subject | Glass transition | - |
dc.subject | Polyimides | - |
dc.subject | Thermal expansion | - |
dc.subject | Hexafluoroisopropylidene | - |
dc.subject | High-glass transition temperatures | - |
dc.subject | Low coefficient of thermal expansions | - |
dc.subject | Mechanical durability | - |
dc.subject | ON/OFF current ratio | - |
dc.subject | Resistive memory | - |
dc.subject | Thermal and mechanical properties | - |
dc.subject | Write-once-read-many | - |
dc.subject | Flexible electronics | - |
dc.title | Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1002/mame.202100512 | - |
dc.identifier.scopus | 2-s2.0-85113297106 | - |
dc.relation.journalvolume | 306 | - |
dc.relation.journalissue | 12 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Chemical Engineering | - |
crisitem.author.dept | Office of the President | - |
crisitem.author.orcid | 0000-0003-3170-7220 | - |
crisitem.author.parentorg | College of Engineering | - |
crisitem.author.parentorg | Administrative Unit | - |
顯示於: | 化學工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。