https://scholars.lib.ntu.edu.tw/handle/123456789/598276
Title: | Thermal and dielectric properties enhancement of photocurable acrylate polymers for digital light processing 3D printed electronics | Authors: | Huang H.-S Liao Y.-C. YING-CHIH LIAO |
Keywords: | blends;dielectric properties;manufacturing;photopolymerization;thermal properties;3D printers;Acrylic monomers;Esters;Photopolymerization;Resins;Acrylate polymers;Blend;Dielectrics property;Digital light processing;Photo polymerization;Photocurable;Polymer networks;Printed electronics;Thermal and dielectric properties;Trimethylolpropane;Dielectric properties | Issue Date: | 2021 | Source: | Journal of Applied Polymer Science | Abstract: | Digital light processing 3D printing has been rapidly evolving conventional manufacturing industry with the most meticulous resolution and strongest layer-to-layer adhesion among all additive manufacturing techniques. In this study, to improve poor polymer thermal stability and dielectric properties from prevailing methyl methacrylate-based resin, tri-functional trimethylolpropane tri-acrylate (TMPTA) is introduced to form a stable polymer network. Meanwhile, monomers carrying non-polar, bulky adamantane are added to eradicate poly-TMPTA's notorious high cracking and warping tendency. Test results showed both high 1-adamantyl methacrylate and 1, 3-adamantyl di-acrylate (ADDA) additions can print crack-free samples. However, only ADDA addition keeps low CTE (82.86 ppm/oC, 200 ~ 260°C) and cuts down Df (0.02, 10 GHz). TMPTA polymer network modifications of both additions are explored. By contrast, poly-MMA exhibits much higher CTE (323.44 ppm/oC) and Df (0.035). A 3D-printed curvilinear circuit board from above resin formulation with electroplated copper circuits successfully passes lead-free level reflow without deformation. ? 2021 Wiley Periodicals LLC. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85121642961&doi=10.1002%2fapp.52070&partnerID=40&md5=03b7c493bae2e18c2b0b479305b17bc9 https://scholars.lib.ntu.edu.tw/handle/123456789/598276 |
ISSN: | 00218995 | DOI: | 10.1002/app.52070 |
Appears in Collections: | 化學工程學系 |
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