Thermal stability of some naphthalene- and phenyl-based epoxy resins
Resource
Polymer Degradation and Stability 84(2004), 305-310
Journal
Polymer Degradation and Stability 84(2004)
Pages
305-310
Date Issued
2004
Date
2004
Author(s)
Duann, Yeh-Fang
Liu, Tsan-Min
Cheng, Kuo-Chung
Su, W.-F.
DOI
246246/2006111501265035
Abstract
Six epoxy monomers were synthesized and cured using 4,4'-methylenedianiline (DDM). The glass transition temperatures (Tg) of
naphthalene- and phenyl-based epoxy resins were in the ranges 175-213℃ and 128e200℃, respectively. Naphthalene-based
epoxy resins 1,5-bis(2,3-epoxypropoxy)naphthalene (A) and 2,7-bis(2,3-epoxypropoxy)naphthalene (B) have almost equal LOIs,
implying that the effects of the position of the substituent on LOI was very weak. 4,4'-Bis(2,3-epoxypropoxy)benzylideneaniline (D)
has the lowest LOI. The same trend was exhibited when some of the epoxy monomers were cured using the curing agent,
sulfanilamide (SAA). The order of the LOIs of the epoxy resins was (B) = (F) > (A) > (E) > (C) > (D), when cured using
4,4'-methylenedianiline (DDM). Degradation proceeds in a single stage in an atmosphere of nitrogen and in two stages in air. At
800℃, the epoxy polymer (D) has the highest char yield of all the epoxy resins.
Subjects
Glass transition temperature (Tg)
Differential scanning calorimetry (DSC)
Thermogravimetric analysis (TGA)
Limited oxygen index
(LOI) tester
(LOI) tester
Publisher
Taipei:National Taiwan University Dept Chem Engn
Type
journal article
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