https://scholars.lib.ntu.edu.tw/handle/123456789/61404
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor | National Taiwan University Dept Chem Engn | en |
dc.contributor.author | Chiu, Jian-Bin | en |
dc.contributor.author | Yu, Cheng-Ching | en |
dc.contributor.author | Shen, Shih-Haur | en |
dc.creator | Chiu, Jian-Bin; Yu, Cheng-Ching; Shen, Shih-Haur | en |
dc.date | 2003 | - |
dc.date.accessioned | 2006-11-14T18:45:58Z | - |
dc.date.accessioned | 2018-06-28T16:57:43Z | - |
dc.date.available | 2006-11-14T18:45:58Z | - |
dc.date.available | 2018-06-28T16:57:43Z | - |
dc.date.issued | 2003 | - |
dc.identifier | 246246/2006111501244184 | en |
dc.identifier.uri | http://ntur.lib.ntu.edu.tw//handle/246246/2006111501244184 | - |
dc.description.abstract | In chemical mechanical polishing (CMP), a two-stage polishing strategy is often employed. A high removal rate (RR) is set at the initial stage, then a lower RR is employed to remove residual metal and extended to the over-polish stage. An analogy between the soft landing of a spacecraft and CMP operation is established and the CMP operation can be viewed as a minimum-time optimal control problem. Measurement uncertainties prevent direct implementation of bang-bang control law for the entire polishing process. Thus, a two-stage CMP operation procedure is devised to ensure robust operation while maintaining a high throughput. | en |
dc.format | application/pdf | en |
dc.format.extent | 1129176 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.language | en_US | en |
dc.language.iso | en_US | en |
dc.publisher | Taipei:National Taiwan University Dept Chem Engn | en |
dc.relation | Microelectronic Engineering 65(2003), 345–356 | en |
dc.relation.ispartof | Microelectronic Engineering 65(2003), 345–356 | - |
dc.source | http://www.sciencedirect.com/ | en |
dc.subject | soft landing | en |
dc.subject | minimum time problem | en |
dc.subject | chemical mechanical polishing | en |
dc.subject | damascene | en |
dc.subject | STI process control | en |
dc.title | A pplication of soft landing to the process control of chemical mechanical polishing | en |
dc.type | journal article | en |
dc.relation.pages | - | - |
dc.identifier.uri.fulltext | http://ntur.lib.ntu.edu.tw/bitstream/246246/2006111501244184/1/7421.pdf | - |
item.openairetype | journal article | - |
item.fulltext | with fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | open | - |
item.languageiso639-1 | en_US | - |
item.cerifentitytype | Publications | - |
顯示於: | 化學工程學系 |
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