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.National Taiwan University / 國立臺灣大學
Project / 研究計畫
開發低溫且無須加壓下進行晶片對接之材料與技術(1/2)
開發低溫且無須加壓下進行晶片對接之材料與技術(1/2)
Details
Primary Data
Project title
開發低溫且無須加壓下進行晶片對接之材料與技術(1/2)
Internal ID
102-2622-E-002-016-CC1
Principal Investigator
C. ROBERT KAO
Start Date
November 1, 2013
End Date
October 31, 2014
Partner Organizations
National Science and Technology Council