https://scholars.lib.ntu.edu.tw/handle/123456789/74109
標題: | 納米級陶瓷粉體膠粒性質與形成鎳基複合電鍍材料之特性分析(1/2) | 作者: | 韋文誠 | 公開日期: | 2000 | 出版社: | 臺北市:國立臺灣大學材料科學與工程學研究所 | 摘要: | 本次研究主要分析超微細碳化矽粉體在胺基磺酸鎳鍍液中的的表面性質及帶電行為,瞭解碳化矽電泳動行為,並進行後續複合電鍍。研究中發現,平均粒徑62 nm 的碳化矽粉體在氯化鎳或胺基磺酸鎳的溶液中,粉體表面都會吸附Ni2+離子而帶正電。此外,在高濃度的電解質的電鍍液中,由於碳化矽表面電雙層被壓縮,其表面電位很低,但仍維持正電荷表面。溶液中過高的pH 會使Ni2+形成水合的Ni(OH)2 沈澱物,降低碳化矽表面電位。經由複合電鍍,SiC 粉體成功的與鎳形成複合鍍膜,從SEM 與TEM 微結構觀察中發現,碳化矽形成軟聚結,但能均勻的分散在鎳的基底中,並抑制鎳晶粒的成長,鎳形成150 nm 的等軸狀晶。其硬度較純鎳提升2 倍。經過400°C,24 小時的熱處理後,SiC/Ni 複合鍍層的耐磨耗性較純鎳提升約50 倍。 This research investigated the electrokinetic behavior and stability of nano-sized SiC particles suspended in various electroplating solutions. Then, SiC powders electrical co-deposited with Ni in a sulfamate bath to form composite coatings. The negative surface of SiC in pH 4~8 will adsorb the Ni2+ ions in the suspensions which contain nickel chloride or nickel sulfamate as electrolytes and the surface charge of SiC reverse to positive. In high concentrated electrolyte of nickel sulfamate suspension, the SiC particles can still maintain positive charge with a low SC reading. The microstructure and mechanical analysis appear that the SiC particles can codeposition with Ni uniformly. The grain growth of Ni in the matrix can be inhibited by the SiC to form a uniaxial grain of 150 nm in average. The hardness and wear resistance of the plating layers are improved by the addition of the SiC and the thermal resistance significantly increases compared with blank sample. |
URI: | http://ntur.lib.ntu.edu.tw//handle/246246/12367 | 其他識別: | 892216E002016 | Rights: | 國立臺灣大學材料科學與工程學研究所 |
顯示於: | 材料科學與工程學系 |
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892216E002016.pdf | 369.73 kB | Adobe PDF | 檢視/開啟 |
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