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  1. NTU Scholars
  2. 工學院
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Please use this identifier to cite or link to this item: https://scholars.lib.ntu.edu.tw/handle/123456789/74303
Title: Effect of abrasive grinding on the strength and reliability of alumina
Authors: Tuan, W. H.
Kuo, J. C.
TuanWH 
Issue Date: 1998
Journal Volume: 18
Journal Issue: 7
Start page/Pages: 799-806
Source: Journal of the European Ceramic Society 
Abstract: 
In the present study, the effect of depth of cut during abrasive grinding on the strength and reliability of alumina is investigated. The reliability is expressed in terms of Weibull modulus. The alumina specimens were prepared by die-pressing and sintering. Large flaws are formed in the surface region during die-pressing. The strength and reliability of the as-sintered alumina specimens are improved after abrasive grinding. The improvement is contributed by the change of flaw size distribution and the introduction of residual stresses during grinding. As the depth of cut is less than 10 μm pass-1, large surface flaws are either removed or reduced in size. The grinding process can induce residual stresses near surface. The presence of the residual stresses enhances the average strength of alumina by roughly 30 MPa. As the depth of cut is increased to 20 μm pass-1, many machining flaws are formed in the surface region. The average strength and Weibull modulus are then decreased. Due to the formation of many surface cracks, residual stresses are released. Therefore, there is no contribution from residual stresses to the strength of the specimens ground with large depth of cut. © 1998 Elsevier Science Limited. All rights reserved.
URI: http://ntur.lib.ntu.edu.tw//handle/246246/95423
https://www.scopus.com/inward/record.uri?eid=2-s2.0-0032117395&doi=10.1016%2fs0955-2219%2897%2900202-1&partnerID=40&md5=c94fb1784564f48dc9fb67c00c8f874e
ISSN: 09552219
SDG/Keyword: Cracks; Grinding (machining); Powders; Pressing (forming); Reliability; Residual stresses; Sintering; Weibull distribution; Ceramic powders; Weibull modulus; Sintered alumina
Appears in Collections:材料科學與工程學系

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