https://scholars.lib.ntu.edu.tw/handle/123456789/74417
標題: | 固液擴散接合法製作電子構裝耐溫微接點研究(Ⅲ)─總計畫 | 作者: | 莊東漢 | 關鍵字: | 界面反應;界面微結構;單質介金屬;Interfacial Reactions;Interfacial Microstructure;Monolithic Intermetallic Compounds | 公開日期: | 2000 | 出版社: | 臺北市:國立臺灣大學材料科學與工程學研究所 | 摘要: | 本研究主要針對高密度電子構裝之接點耐熱性提高要求,有系統的探討一種所謂「固液擴散接合方法」之製程條件及其反應機裡。研究內容包括界面反應物分析及成長動力學、相對擴散機理、界面微接合、接合機械性質;研究同時參考相平衡圖製作可能形成之介金屬化合物,分析此單質介金屬樣品之機械性質、電磁性質與腐蝕性質。 The research in this project focused on the increasing thermal resistance demand of interconnectors in high density electronic packages. For this purpose, a novel technique ²solid-liquid interdiffusion bonding (SLID)² was developed. The efforts of this group project were focused on interfacial reactions during the the SLID process, and analysis of the interfacial microstructure, micro-chemistry and mechanical properties of the joint after SLID. Parallel with the bonding studies, the relevant intermetallic compounds formed during the SLID process have been prepared externally with reference to their phase diagrams. The mechanical, electrical, magnetic and corrosion properties of these monolithic intermetallic compounds were analyzed. |
URI: | http://ntur.lib.ntu.edu.tw//handle/246246/12376 | 其他識別: | 892216E002028 | Rights: | 國立臺灣大學材料科學與工程學研究所 |
顯示於: | 材料科學與工程學系 |
檔案 | 描述 | 大小 | 格式 | |
---|---|---|---|---|
892216E002028.pdf | 1.15 MB | Adobe PDF | 檢視/開啟 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。