無鉛銲錫球格陣列構裝製程與可靠度分析─總計畫
Date Issued
2001
Date
2001
Author(s)
DOI
892216E002055
Abstract
The study focuses on the process
and reliability of the ball grid array
package. We select the popular
Sn-3.5Ag lead-free solder for this test
and use Sn-37Pb solder as comparison
with Sn-3.5Ag solder. The study
includes the reflow profile of Sn-3.5Ag
solder, the effect of mechanical
properties for different reflow cycles and
long-term aging time and analysis of
failure mode by microstucture. The
results appear that there is no effect on
the solder joint strength for different
reflow cycles. In the aspect of long-term
aging, we find that the strength of solder
joints decreases by increasing the aging
time and in each different aging time,
the strength of Sn-3.5Ag solder joint is
higher than Sn-37Pb one. After 480
hours at 120℃ in the aging treatment,
the fractography still appears the ductile
fracture mode but the Sn-37Pb solder
fractures in the intermetallic compound
layers after 115 hours at 120℃.
Subjects
ball grid array package
lead-free solder
ductile fracture
Publisher
臺北市：國立臺灣大學材料科學與工程學研究所
Type
report
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