https://scholars.lib.ntu.edu.tw/handle/123456789/74451
標題: | 無鉛銲錫球格陣列構裝製程與可靠度分析─子計畫一: 無鉛銲錫球格陣列構裝接點之冷熱循環與動態疲勞分析(II) | 作者: | 莊東漢 | 關鍵字: | 無鉛銲錫;球格陣列構裝;冷熱循環試驗;動態疲勞試驗;電性分析;Pb-free solder;ball grid array package;temperature cycling test;dynamic fatigue test;electrical analysis | 公開日期: | 2002 | 出版社: | 臺北市:國立臺灣大學材料科學與工程學研究所 | 摘要: | 球格陣列構裝(BGA) 具有高密度、優良電性與散熱性、低成本、高產品良率等優點,再加上其與表面實裝技術的共容性,使其快速普及化。因應電子工業無鉛銲錫的時代潮流,本群體計畫將針對球格陣列構裝改用無鉛銲錫球之製程與可靠度進行研發分析。針對可靠度試驗,本子計畫主要負責「冷熱循環試驗」與「動態疲勞試驗」。本年度先以Sn-58Bi無鉛銲錫為對象,進行動態疲勞試驗及冷熱循環試驗,同時加入電性分析,以提供更直接的應用參考數據,也將藉此有系統的探討錫球接點介金屬成長、組織變化以及裂縫形成等對於接點電性的影響。 Among the merits of ball grid array (BGA) packages are high I/O density, good electrical properties, fine heat dissipation capability, low cost and high yield rates. It is small wonder that BGA has been gaining popularity in related fields when capped with the compatibility with surface mount technology (SMT). Responding to the lead-free trend in the electronic industry, this project is devoted to the manufacturing study and reliability analysis of ball grid array packages by adopting Pb-free solder balls in lieu of traditional Pb-Sn solders. With respect to the reliability analysis, temperature cycling and dynamic fatigue testing are scheduled in this subprogram. In the second year of this project, the electrical analyses have been involved in addition to the dynamic fatigue test and thermal cycling test, in order to shed more light on viable data resources for the applications. Through the electrical analysis, the influences of intermetallic growth, microstructure changes and crack formation upon the electrical properties of solder joints will also be systematically investigated. |
URI: | http://ntur.lib.ntu.edu.tw//handle/246246/12410 | 其他識別: | 902216E002032 | Rights: | 國立臺灣大學材料科學與工程學研究所 |
顯示於: | 材料科學與工程學系 |
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902216E002032.pdf | 321.8 kB | Adobe PDF | 檢視/開啟 |
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