DC 欄位 | 值 | 語言 |
dc.contributor.author | 莊東漢 | zh_TW |
dc.creator | 莊東漢 | - |
dc.date | 2002 | zh_TW |
dc.date.accessioned | 2006-07-25T10:42:20Z | - |
dc.date.accessioned | 2018-06-28T21:58:12Z | - |
dc.date.available | 2006-07-25T10:42:20Z | - |
dc.date.available | 2018-06-28T21:58:12Z | - |
dc.date.issued | 2002 | - |
dc.identifier | 902216E002032 | zh_TW |
dc.identifier.uri | http://ntur.lib.ntu.edu.tw//handle/246246/12410 | - |
dc.description.abstract | 球格陣列構裝(BGA) 具有高密度、優良電性與散熱性、低成本、高產品良率等優點,再加上其與表面實裝技術的共容性,使其快速普及化。因應電子工業無鉛銲錫的時代潮流,本群體計畫將針對球格陣列構裝改用無鉛銲錫球之製程與可靠度進行研發分析。針對可靠度試驗,本子計畫主要負責「冷熱循環試驗」與「動態疲勞試驗」。本年度先以Sn-58Bi無鉛銲錫為對象,進行動態疲勞試驗及冷熱循環試驗,同時加入電性分析,以提供更直接的應用參考數據,也將藉此有系統的探討錫球接點介金屬成長、組織變化以及裂縫形成等對於接點電性的影響。 | zh_TW |
dc.description.abstract | Among the merits of ball grid array
(BGA) packages are high I/O density,
good electrical properties, fine heat
dissipation capability, low cost and high
yield rates. It is small wonder that BGA
has been gaining popularity in related
fields when capped with the
compatibility with surface mount
technology (SMT). Responding to the
lead-free trend in the electronic industry,
this project is devoted to the
manufacturing study and reliability
analysis of ball grid array packages by
adopting Pb-free solder balls in lieu of
traditional Pb-Sn solders. With respect to
the reliability analysis, temperature
cycling and dynamic fatigue testing are
scheduled in this subprogram. In the
second year of this project, the electrical
analyses have been involved in addition
to the dynamic fatigue test and thermal
cycling test, in order to shed more light
on viable data resources for the
applications. Through the electrical
analysis, the influences of intermetallic
growth, microstructure changes and
crack formation upon the electrical
properties of solder joints will also be
systematically investigated. | en |
dc.format | application/pdf | zh_TW |
dc.format.extent | 329525 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.language | zh-TW | zh_TW |
dc.language.iso | zh_TW | - |
dc.publisher | 臺北市:國立臺灣大學材料科學與工程學研究所 | zh_TW |
dc.rights | 國立臺灣大學材料科學與工程學研究所 | zh_TW |
dc.subject | 無鉛銲錫 | zh_TW |
dc.subject | 球格陣列構裝 | zh_TW |
dc.subject | 冷熱循環試驗 | zh_TW |
dc.subject | 動態疲勞試驗 | zh_TW |
dc.subject | 電性分析 | zh_TW |
dc.subject | Pb-free solder | en |
dc.subject | ball grid array package | en |
dc.subject | temperature cycling test | en |
dc.subject | dynamic fatigue test | en |
dc.subject | electrical analysis | en |
dc.title | 無鉛銲錫球格陣列構裝製程與可靠度分析─子計畫一: 無鉛銲錫球格陣列構裝接點之冷熱循環與動態疲勞分析(II) | zh_TW |
dc.type | report | en |
dc.identifier.uri.fulltext | http://ntur.lib.ntu.edu.tw/bitstream/246246/12410/1/902216E002032.pdf | - |
dc.coverage | 計畫年度:90;起迄日期:2001-08-01/2002-07-31 | zh_TW |
item.languageiso639-1 | zh_TW | - |
item.cerifentitytype | Publications | - |
item.grantfulltext | open | - |
item.fulltext | with fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_93fc | - |
item.openairetype | report | - |
顯示於: | 材料科學與工程學系
|