https://scholars.lib.ntu.edu.tw/handle/123456789/74668
Title: | Pronounced electromigration of Cu in molten Sn-based solders | Authors: | Huang, J. R. Tsai, C. M. Lin, Y. W. Kao, C. R. |
Issue Date: | 2008 | Journal Volume: | 23 | Journal Issue: | 1 | Start page/Pages: | 250-257 | Source: | Journal of Materials Research | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/95488 |
Appears in Collections: | 材料科學與工程學系 |
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