https://scholars.lib.ntu.edu.tw/handle/123456789/74668
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Huang, J. R. | en |
dc.contributor.author | Tsai, C. M. | en |
dc.contributor.author | Lin, Y. W. | en |
dc.contributor.author | Kao, C. R. | en |
dc.creator | Huang, J. R.; Tsai, C. M.; Lin, Y. W.; Kao, C. R. | en |
dc.date | 2008 | en |
dc.date.accessioned | 2008-12-31T02:26:48Z | - |
dc.date.accessioned | 2018-06-28T22:00:42Z | - |
dc.date.available | 2008-12-31T02:26:48Z | - |
dc.date.available | 2018-06-28T22:00:42Z | - |
dc.date.issued | 2008 | - |
dc.identifier.uri | http://ntur.lib.ntu.edu.tw//handle/246246/95488 | - |
dc.format | application/pdf | en |
dc.format.extent | 1081686 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.language | en | en |
dc.language.iso | en_US | - |
dc.relation | Journal of Materials Research 23 (1): 250-257 | en |
dc.relation.ispartof | Journal of Materials Research | - |
dc.title | Pronounced electromigration of Cu in molten Sn-based solders | en |
dc.type | journal article | en |
dc.relation.pages | 250-257 | - |
dc.relation.journalvolume | 23 | - |
dc.relation.journalissue | 1 | - |
dc.identifier.uri.fulltext | http://ntur.lib.ntu.edu.tw/bitstream/246246/95488/1/11.pdf | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.languageiso639-1 | en_US | - |
item.grantfulltext | open | - |
item.cerifentitytype | Publications | - |
item.fulltext | with fulltext | - |
顯示於: | 材料科學與工程學系 |
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